Examination of Fiberboard from Shipping Package 9975-01819

Upon opening package 9975-01819 following approximately 5.5 years storage in KAMS, it was observed that the fiberboard was moldy, and the total height of the fiberboard assemblies was less than normal. Observations and measurements have since been made on three subsequent occasions. The available information indicates that the package contained approximately 2.5 liters of water in excess of what would normally exist within the fiberboard. This excess moisture led to a significant loss of fiberboard strength, the subsequent compression of the bottom layers, and the growth of mold observed on both the upper and lower fiberboard assemblies. In its current state, the fiberboard from this package retains a density (related to the criticality control function) within the range measured in other packages. The amount of excess moisture present is modest throughout most of the fiberboard, and its effect on thermal conductivity should be small. The thermal conductivity should increase significantly only near the bottom of the lower fiberboard assembly where the majority of excess moisture was found. The impact absorption capability is affected, and the ability of the fiberboard to perform this function in the current state must be evaluated. The longer such a condition persists, the greater the impact on fiberboard mechanical properties.

  • Record URL:
  • Corporate Authors:

    Savannah River National Laboratory

    Aiken, SC  United States 

    Department of Energy

    1000 Independence Avenue, SW
    Washington, DC  United States  20585
  • Authors:
    • Daugherty, W L
  • Publication Date: 2009-4

Language

  • English

Media Info

  • Media Type: Print
  • Pagination: 21p

Subject/Index Terms

Filing Info

  • Accession Number: 01150276
  • Record Type: Publication
  • Report/Paper Numbers: SRNL-STI-2009-00240
  • Contract Numbers: DE-AC09-8SR22470
  • Files: TRIS
  • Created Date: Feb 9 2010 2:15PM