The construction and design features of current generation microtechnology electronics result in devices which can be destroyed or degraded by the discharge of static electricity. This electrostatic discharge (ESD) damage phenomenon became known in industry because of low yields of metal oxide semiconductors and other ESDF sensitive items, especially at the device production level. Yet today, overall industry implementation of ESD controls is not uniform and is not being instituted at a satisfactory rate. Worse, the Government and Navy personnel are generally even less knowledgeable of ESD hazards, their effects and what to do about it. This lack of knowledge is resulting in unnecessary repair costs, excessive equipment downtime and reduced mission effectiveness in that these devices and equipment which incorporates them are being damaged throughout the equipment life cycle during processing, assembly, inspection, handling, packaging, shipping, storage, testing and maintenance. Unfortunately, even if the equipment or device contractor has instituted procedures for ESD control, very little of this information is reflected in Government training course materials and in other documents such as technical manuals. ESD controls, therefore, must be established and implemented throughout all phases of hardware design, production, test and fleet operation and maintenance.

  • Supplemental Notes:
    • Sixteenth Annual Technical Symposium of the Association of Scientists and Engineers of the Naval Sea Systems Command, held in Arlington, Virginia, March 30, 1979.
  • Corporate Authors:

    Association of Scientists and Engineers of NASSC

    Department of the Navy
    Washington, DC  United States  203632
  • Publication Date: 1979

Media Info

  • Features: References;
  • Pagination: 32 p.

Subject/Index Terms

Filing Info

  • Accession Number: 00190256
  • Record Type: Publication
  • Source Agency: Association of Scientists and Engineers of NASSC
  • Files: TRIS
  • Created Date: Apr 25 1979 12:00AM