Hong Kong highways viaduct pieced together

The construction of the 1.4km-long Lai Chi Kok Viaduct (LCKV) in Hong Kong is described. The dual, three-lane LCKV passes through the industrial area of Cheung Sha Wan before crossing over Ching Cheung Road. Other constraints include four major roads, drainage culverts, power cables and Mass Transit Railway tunnels. The viaduct consists of a precast segmental box girder deck with span lengths of 60-80m. The deck is supported on single columns, but with portal frames used to span over critical ground constraints where necessary. The structure is supported on large-diameter bored piles constructed to 40m depths. Rock sockets provide lateral resistance for the piles. Pilecaps transfer the column loads to the piles. Foundation work was the responsibility of Tysan and Vibro. The superstructure uses a continuous deck design, resulting in a small number of movement joints. The viaduct has a combination of external and internal post-tensioning. The main contractor, Acciona, erected the main structure using a combination of segment lifting methods.

Language

  • English

Media Info

Subject/Index Terms

Filing Info

  • Accession Number: 01045812
  • Record Type: Publication
  • Source Agency: Transport Research Laboratory
  • Files: ITRD
  • Created Date: Apr 5 2007 12:20PM