EXPERIMENTAL ELECTRONIC METHOD OF MEASURING SETTLEMENTS UNDER A HIGH FILL

Experience with existing methods led to the development of an electronic settlement plate by the South Dakota Department of Transportation. Constructed from common hardware and electrical components, the device is acurate, dependable and inexpensive. Installation and operation is straightforward and simple. Ten gauges were fabricated and installed. Performance characteristics have been excellent. Lengthy, maintenance-free operation is proven by successful use of gauges which have been buried under highway fills for up to nine years. The device is limited to measurement of total settlement beneath the plate as opposed to devices capable of measuring settlement at multi-elevations. It is believed that the electronic settlement plate is superior to existing settlement instrumentation devices for measuring settlement of soils beneath a fill. Measurements of moisture and density variation, as relates to settlement of an insitu fill foundation soil, were to have been made. A radioactive down-the-hole probe was used in conjunction with a continuous logger to determine moisture-density variations. Installation of access tubes to depths greater than 20 feet (6.1 m) was found to be impractical and this portion of the study was terminated. /Authors/

  • Corporate Authors:

    South Dakota Department of Transportation

    Division of Highways, Foundation and Geology Program
    Pierre, SD  United States  57501
  • Authors:
    • Bump, V L
    • Gnirk, P F
  • Publication Date: 1977-10

Media Info

  • Features: Appendices; Figures;
  • Pagination: 57 p.

Subject/Index Terms

Filing Info

  • Accession Number: 00185423
  • Record Type: Publication
  • Source Agency: Federal Highway Administration
  • Report/Paper Numbers: FHWA-RD-78-S0778 Final Rpt., FCP 40S8-522
  • Contract Numbers: HP5854
  • Files: TRIS, USDOT, STATEDOT
  • Created Date: Mar 14 1979 12:00AM