PACKAGING AIRCRAFT ENGINE INSTRUMENTS

Today's aircraft instruments offer improved performance and reliability in a smaller package size. The authors report how extensive use has been made of CMOS to reduce power, size and weight. The instruments described are based upon three aspects of design: solid-state signal processing, optoelectronic display format, and planned redundancy. Each instrument is packaged so that the P/C boards are readily accessible and can be placed on extension boards, resulting in a simplified servicing operation.

  • Corporate Authors:

    Kiver (Milton S) Publications, Incorporated

    222 West Adams Street
    Chicago, IL  USA  60606
  • Authors:
    • Kivenko, K
    • RAUCH, S
  • Publication Date: 1977-4

Media Info

Subject/Index Terms

Filing Info

  • Accession Number: 00173089
  • Record Type: Publication
  • Source Agency: Engineering Index
  • Files: TRIS
  • Created Date: Jun 14 1978 12:00AM