SCANNING ELECTRON MICROSCOPY AS AN INTEGRAL TECHNIQUE IN FAILURE ANALYSIS

The scanning electron microscope (SEM) with its large depth of field, wide range of magnification, and ease of operation is a powerful tool for analyzing structural failures. It is, however, just one of a number of tools and techniques available for failure analysis and associated service, production, quality control, engineering, or research problems. For successful utilization, the SEM must be part of an overall integrated analytical technique which combines electron and optical microscopy, microprobe, X-ray diffraction, and metallography. By using an integrated approach the macro and microtropography of fracture surfaces can be characterized and correlated with the chemistry of surface deposits and microstructure. This information correlated with service history, alloy composition and heat treatment often provides an answer as to why a part has failed. /Author/

• Availability:
  • Find a library where document is available. Order URL: http://worldcat.org/issn/00255327
• Corporate Authors:

  American Society for Nondestructive Testing

  914 Chicago Avenue
  Evanston, IL  United States  60202
• Authors:
  • Dahlberg, E P
  • Bradley, S A
• Publication Date: 1977-11

Media Info

• Pagination: p. 43-48
• Serial:
  • Materials Evaluation
  • Volume: 35
  • Issue Number: 11
  • Publisher: American Society for Nondestructive Testing
  • ISSN: 0025-5327

Subject/Index Terms

• TRT Terms: Alloys; Deposits (Geology); Diffraction; Electron microscopes; Failure; Quality control; Structural mechanics; X rays
• Uncontrolled Terms: Structural failures; X-ray diffraction
• Old TRIS Terms: Deposits
• Subject Areas: Geotechnology; Highways; Materials;

Filing Info

• Accession Number: 00165854
• Record Type: Publication
• Files: TRIS
• Created Date: Dec 8 1977 12:00AM