Thermal shock is the stress a device (component or equipment) undergoes when it is alternately switched from a high-temperature environment to a low-temperature environment. Permanent changes in operating characteristics and physical damage produced during these tests result principally from variations in dimensions and other physical properties. Effects of thermal shock include cracking and delamination of finishes, cracking and crazing of embedding and encapsulating compounds, opening of thermal seals and case seams, leakage of filling materials, and changes in electrical characteristics as a result of mechanical displacement or rupture of conductors or of insulating materials. This article will discuss briefly the following matters related to the thermal shock environment. 1. Military specifications covering the thermal shock and temperature cycling (TS/TC) environments. 2. Thermal lag of components. 3. Test chambers for conducting the TS/TC environment. 4. CO sub 2/LN sub 2 versus mechanical cooling. 5. Liquid CO sub 2 consumption. 6. Liquids for heat transfer media.

Media Info

  • Features: Figures; Photos; References; Tables;
  • Pagination: p. 10-16
  • Serial:

Subject/Index Terms

Filing Info

  • Accession Number: 00032664
  • Record Type: Publication
  • Source Agency: United States Merchant Marine Academy
  • Files: TRIS
  • Created Date: Apr 21 1972 12:00AM