This paper reviews the steps taken by the semiconductor industry to be responsive to the requirements of the automotive industry, with special emphasis on one recently developed and highly cost-effective method to control and improve device reliability. Two new product innovations, one combining MOS and bipolar technology to produce a high performance and versatile operational amplifier integrated circuit, and the other an inherently more reliable process for IC manufacture involving a hermetic silicon die and a corrosion resistant lead connection system are also described, particularly as they relate to automotive applications. /GMRL/

  • Supplemental Notes:
    • From Automotive Electronics II, pp43-48, 1975.
  • Corporate Authors:

    Society of Automotive Engineers (SAE)

    400 Commonwealth Drive
    Warrendale, PA  United States  15096
  • Authors:
    • Cohen, R M
  • Publication Date: 1975

Media Info

  • Pagination: 6 p.

Subject/Index Terms

Filing Info

  • Accession Number: 00127191
  • Record Type: Publication
  • Report/Paper Numbers: SAE #750202
  • Files: TRIS
  • Created Date: Jan 14 1976 12:00AM