This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other "rivet bonded" structures.

  • Supplemental Notes:
    • From the SAE Meeting held February 25-29, 1980.
  • Corporate Authors:

    Society of Automotive Engineers (SAE)

    400 Commonwealth Drive
    Warrendale, PA  United States  15096
  • Authors:
    • Bolger, J C
  • Publication Date: 1980

Media Info

Subject/Index Terms

Filing Info

  • Accession Number: 00322892
  • Record Type: Publication
  • Source Agency: Engineering Index
  • Report/Paper Numbers: SAE 800209
  • Files: TRIS
  • Created Date: Jan 19 1981 12:00AM