EPOXY ADHESIVES FOR AUTOMOTIVE ASSEMBLY OPERATIONS
This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other "rivet bonded" structures.
- From the SAE Meeting held February 25-29, 1980.
Warrendale, PA United States 15096
- Bolger, J C
- Publication Date: 1980
- Features: References;
- Pagination: 16 p.
- Society of Automotive Engineers Preprint
- Publisher: Society of Automotive Engineers (SAE)
- TRT Terms: Adhesives; Automobile industry; Bonding; Costs; Epoxides; Epoxy resins; Halogens; Headlamps; Joints (Engineering); Motor vehicle bodies; School buses; Taxicabs
- Old TRIS Terms: Automobile bodies; Automobile manufacture; Automotive assembly operations; Epoxy; Joint; Rivet bonding; Weld bonding
- Subject Areas: Finance; Geotechnology; Highways; Materials; Vehicles and Equipment; I35: Miscellaneous Materials; I91: Vehicle Design and Safety;
- Accession Number: 00322892
- Record Type: Publication
- Source Agency: Engineering Index
- Report/Paper Numbers: SAE 800209
- Files: TRIS
- Created Date: Jan 19 1981 12:00AM