EPOXY ADHESIVES FOR AUTOMOTIVE ASSEMBLY OPERATIONS

This paper describes several new epoxy adhesives and bonding processes specifically developed for high volume, low cost automotive assembly operations. The applications include halogen-quartz headlamps; assembly of a variety of under-the-hood electrical and electronic components; a one component epoxy body solder used since 1971 to replace lead in the exposed body joints of taxicabs and other vehicles; and low temperature curing, flexible epoxy adhesives used to increase the strength of steel body joints of school buses and other "rivet bonded" structures.

• Supplemental Notes:
  • From the SAE Meeting held February 25-29, 1980.
• Corporate Authors:

  Society of Automotive Engineers (SAE)

  400 Commonwealth Drive
  Warrendale, PA  United States  15096
• Authors:
  • Bolger, J C
• Publication Date: 1980

Media Info

• Features: References;
• Pagination: 16 p.
• Serial:
  • Society of Automotive Engineers Preprint
  • Publisher: Society of Automotive Engineers (SAE)

Subject/Index Terms

• TRT Terms: Adhesives; Automobile industry; Bonding; Costs; Epoxides; Epoxy resins; Halogens; Headlamps; Joints (Engineering); Motor vehicle bodies; School buses; Taxicabs
• Old TRIS Terms: Automobile bodies; Automobile manufacture; Automotive assembly operations; Epoxy; Joint; Rivet bonding; Weld bonding
• Subject Areas: Finance; Geotechnology; Highways; Materials; Vehicles and Equipment; I35: Miscellaneous Materials; I91: Vehicle Design and Safety;

Filing Info

• Accession Number: 00322892
• Record Type: Publication
• Source Agency: Engineering Index
• Report/Paper Numbers: SAE 800209
• Files: TRIS
• Created Date: Jan 19 1981 12:00AM