The field of integrated solid-state technology is most broad. In this paper, hybrid monolithic thin-film and thick-film technologies are discussed with emphasis on monolithic integrated circuits. Processing, component construction, characteristics and limitations of the components, and pertinent parasitic effects are described and illustrated. Packaging, thermal consideration, reliability, and cost are discussed as well.

  • Availability:
  • Supplemental Notes:
    • From: Automotive Electronics, SAE SP-388, 38-66, February 1974; SAE Paper No. 740011.
  • Corporate Authors:

    Society of Automotive Engineers

    485 Lexington Avenue
    New York, NY  United States  10017
  • Authors:
    • Wheatley Jr, C F
  • Publication Date: 1974-2

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Subject/Index Terms

Filing Info

  • Accession Number: 00264209
  • Record Type: Publication
  • Report/Paper Numbers: SAE Paper No. 740011
  • Files: TRIS
  • Created Date: Dec 31 1974 12:00AM