One-mm 3D Laser Imaging Survey for Comprehensive Runway Evaluation

Based on the application of 1mm 3D imaging technology for pavement survey, and through the use of inertial and other types of profiling devices, it is possible to establish a virtual runway with necessary x, y, and elevation accuracies for engineering analysis. A field example of such application is illustrated on a full-size runway that was surveyed in the spring of 2014 with the PaveVision3D technology of WayLink Systems Company, inertial profiling for longitudinal profiles, and an inclinometer based reference device for transverse profiling. The potential applications of a virtual runway include nearly all surface evaluations of runways, including longitudinal profiling for Boeing bumps, transverse profiling, grooving analysis, and various distresses. The most important application of a virtual runway is that complete surface of the runway at 1mm resolution is available to engineers who may choose to examine anywhere on the runway for defects and study remedial actions, now or later.

Language

  • English

Media Info

  • Media Type: Digital/other
  • Features: Figures; Photos; References; Tables;
  • Pagination: 13p
  • Monograph Title: 2014 FAA Worldwide Airport Technology Transfer Conference Proceedings: Innovations in Airport Safety and Pavement Technology

Subject/Index Terms

Filing Info

  • Accession Number: 01538135
  • Record Type: Publication
  • Report/Paper Numbers: P10041
  • Files: TRIS, ATRI, USDOT
  • Created Date: Sep 9 2014 7:00AM