PACKAGING AIRCRAFT ENGINE INSTRUMENTS

Today's aircraft instruments offer improved performance and reliability in a smaller package size. The authors report how extensive use has been made of CMOS to reduce power, size and weight. The instruments described are based upon three aspects of design: solid-state signal processing, optoelectronic display format, and planned redundancy. Each instrument is packaged so that the P/C boards are readily accessible and can be placed on extension boards, resulting in a simplified servicing operation.

• Corporate Authors:

  Kiver (Milton S) Publications, Incorporated

  222 West Adams Street
  Chicago, IL  United States  60606
• Authors:
  • Kivenko, K
  • Rauch, S
• Publication Date: 1977-4

Media Info

• Pagination: 3 p.
• Serial:
  • Electronic Packaging and Production
  • Volume: 17
  • Issue Number: 4
  • Publisher: Kiver (Milton S) Publications, Incorporated

Subject/Index Terms

• TRT Terms: Airborne navigational aids; Electric circuits; Electronics; Instrumentation; Integrated circuits; Packaging; Performance
• Uncontrolled Terms: Aircraft instruments
• Old TRIS Terms: Circuits
• Subject Areas: Aviation; Freight Transportation; Vehicles and Equipment;

Filing Info

• Accession Number: 00173089
• Record Type: Publication
• Source Agency: Engineering Index
• Files: TRIS
• Created Date: Jun 14 1978 12:00AM