HIGH RELIABILITY ABSOLUTE SEMICONDUCTOR PRESSURE SENSOR

This paper describes an absolute semiconductor pressure sensor suitable for the engine control systems in automobiles. Using the passive (electrically nonconnected) side of a sensor chip as the pressure interface, it has good pressure media compatibility. But it requires a pedestal with a pressure inlet hole and a larger contact area for good sealed, vacuum reference, since the larger contact area causes a larger temperature shift of the offset voltage due to thermal stress. We have analyzed the thermal stress by the finite element method and have designed a lower, tubular pedestal with a groove which has isolated the sensor chip from the thermal stress more effectively. As a result, the sensor chip has been assembled in a standard TO-5 package and a temperature shift of the offset voltage within plus or minus 1% error of FS (Full Scale) without temperature compensation in the temperature range of minus 30 deg C to 100 deg C has been realized.

• Supplemental Notes:
  • Sensors and Actuators (1983) SP-536. International Congress and Exposition, Detroit, Michigan, February 28-March 4, 1983.
• Corporate Authors:

  Society of Automotive Engineers (SAE)

  400 Commonwealth Drive
  Warrendale, PA  United States  15096
• Authors:
  • Bessho, M
  • Tsuru, Y
  • Horiike, H
  • Jinmon, M
  • Yamagami, K
  • Wataya, S
• Publication Date: 1983-2

Media Info

• Features: Figures; References; Tables;
• Pagination: p. 55-59
• Serial:
  • Publication of: Canada Centre for Remote Sensing
  • Publisher: Canada Centre for Remote Sensing

Subject/Index Terms

• TRT Terms: Automobiles; Electronic control; Exhaust gas recirculation; Fuel injection; Ignition systems; Pressure gages; Semiconductors; Sensors; Vehicle power plants
• Old TRIS Terms: Electronic engine control; Pressure sensors
• Subject Areas: Safety and Human Factors; Vehicles and Equipment;

Filing Info

• Accession Number: 00372772
• Record Type: Publication
• Source Agency: National Highway Traffic Safety Administration
• Report/Paper Numbers: SAE 830108, HS-034 357
• Files: HSL, USDOT
• Created Date: May 31 1983 12:00AM