EPOXIES THAT CURE AT 20 BELOW

A BREAKTHROUGH IN EPOXY RESIN RESEARCH HAS BROUGHT A SERIES OF EPOXIES THAT CURE AT -20 F. THE NEW SERIES OF ADHESIVES THUS HAS A DUAL USE. THEY BOND AT LOW TEMPERATURES, PREVIOUSLY CONSIDERED IMPOSSIBLE, AND BECAUSE OF THEIR EXTREMELY RAPID CURE TIMES AT NORMAL AMBIENT TEMPERATURES THEY CAN BE USED IN APPLICATIONS WHERE FAST BONDING IS EITHER HIGHLY DESIRABLE OR AN ABSOLUTE NECESSITY. POT LIFE AND CURE TIMES VARY AS TO THE DIFFERENT PRODUCTS IN THE SERIES. ADHESIVE STRENGTHS RANGE FROM 3000-6000 PSI TENSILE WITH THE PERCENTAGE OF ELONGATION FROM A HIGH OF 60 PERCENT TO A LOW OF 10 PERCENT. CHEMICAL RESISTANCE IS EXCELLENT TO WATER, FUELS, OILS AND ALKALIES, AND GOOD TO MINERAL ACIDS. /AUTHOR/

  • Supplemental Notes:
    • Vol 108, No 11, P 99
  • Publication Date: 1965-11

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  • Accession Number: 00216092
  • Record Type: Publication
  • Files: TRIS
  • Created Date: Jul 28 1994 12:00AM