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    <title>Transport Research International Documentation (TRID)</title>
    <link>https://trid.trb.org/</link>
    <atom:link href="https://trid.trb.org/Record/RSS?s=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" rel="self" type="application/rss+xml" />
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    <language>en-us</language>
    <copyright>Copyright © 2026. National Academy of Sciences. All rights reserved.</copyright>
    <docs>http://blogs.law.harvard.edu/tech/rss</docs>
    <managingEditor>tris-trb@nas.edu (Bill McLeod)</managingEditor>
    <webMaster>tris-trb@nas.edu (Bill McLeod)</webMaster>
    <image>
      <title>Transport Research International Documentation (TRID)</title>
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      <link>https://trid.trb.org/</link>
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    <item>
      <title>Investigation of a Low-Power Consumption Decoding Method in an Axial Field Variable Reluctance Resolver</title>
      <link>https://trid.trb.org/View/2511569</link>
      <description><![CDATA[The axial field slotless resolver with a leaf-style rotor has been proposed with the advantages of its small size and simple manufacturing, which are extremely welcome in the industrial powertrain system. It is attractive to adopt the printed circuit board (PCB) windings instead of the traditional enameled wires. However, the field excitation (EXC) is too weak to generate a significant electromagnetic force for the axial field slotless resolvers. This is because the slotless coupling makes a high path reluctance; besides, the PCB windings have a limited number of coils. To satisfy the decoding requirement, a square wave injection was applied to generate high-level electromotive force (EMF) signals. Even though, this interesting injection scheme needs a high-power excitation to make a strong magnetic field so to induce the SIN/COS coils EMFs. This article proposes an asymmetric narrow pulse injection (ANPI) scheme, which can excite a good tracking envelope but requiring only a low power consumption. Furthermore, the feedback error suppression by rotor contour designing is discussed. The proposed low-power consumption decoding method is realized with an axial field slotless resolver.]]></description>
      <pubDate>Mon, 23 Feb 2026 10:06:30 GMT</pubDate>
      <guid>https://trid.trb.org/View/2511569</guid>
    </item>
    <item>
      <title>Multi-Physics Simulation and Reliability Analysis of Onboard EV Charger</title>
      <link>https://trid.trb.org/View/2669757</link>
      <description><![CDATA[The rapid advancement of electric vehicle (EV) technology has created a demand for reliable and Thermal - efficient electronic components for power electronics and control systems on printed circuit boards (PCBs). The research looks at the overall simulation and study of a PCB for Electric Vehicles, including how it handles heat, stress, and reliability in real working conditions like considering casing (Heat Sink) in which PCB is held, into the simulation. We have used numerical based methods (reliability), Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) methods to simulate heat performance looking at steady-state and changing load profiles common in EV powertrains. We ran structural and thermal simulations to check the PCB's toughness against heat expansion and shaking loads often seen in cars. We also did a reliability check looking at heat cycling life for PCB components, and possible ways it could break to guess long-term toughness. The results show critical hot spots in the PCB design, structure warping from mechanical stress, and highlighted key things that affect how long the PCB components can lasts. Based on these simulations, we suggested some ways to manage heat, and structural rigidity, like selecting better materials and placing parts at smarter location. This study shows a step-by-step way to use multi-physics simulations early when designing EV PCBs leading to better heat control mechanical toughness, and overall system reliability.]]></description>
      <pubDate>Tue, 17 Feb 2026 10:36:26 GMT</pubDate>
      <guid>https://trid.trb.org/View/2669757</guid>
    </item>
    <item>
      <title>Modelling and Analysis of Complex Shaped Cracks</title>
      <link>https://trid.trb.org/View/2669777</link>
      <description><![CDATA[This study provides an extensive analysis through finite element analysis (FEA) on the effects of fatigue crack growth in three different materials: Structural steel, Titanium alloy (Ti Grade 2), and printed circuit board (PCB) laminates based on epoxy/aramid. A simulation of the materials was created using ANSYS Workbench with static and cyclic loading to examine how the materials were expected to fail. The method was based on LEFM and made use of the Maximum Circumferential Stress Criterion to predict where cracks would happen and how they would progress. Normalizing SIFs while a crack was under mixed loading conditions was achieved using the EDI method [84]. We used Paris Law to model fatigue crack growth using constants (C and m) for the materials from previous studies and/or tests. For example, in the case of titanium Grade 2, we found Paris Law constants with C values from 1.8 × 10-10 to 7.9 × 10-12 m/cycle and m values from 2.4 to 4.3, which illustrate differing effects of their manufacture processes and microstructure. Detailed Paris Law constants are limited for the epoxy/aramid laminates, but other similar composite materials, for example, VARTM composites, have shown that under certain conditions the Paris Law could be applicable. In determining the performance of the materials, we assessed various mechanical responses (total deformation, directional stiffness) and all were also noted with respect to the likely progression of these fatigue cracks given the long-term nature of the study.]]></description>
      <pubDate>Tue, 17 Feb 2026 10:28:09 GMT</pubDate>
      <guid>https://trid.trb.org/View/2669777</guid>
    </item>
    <item>
      <title>Study of Robust Design to Ensure the Manufacturing Quality of High-Density Mounted Electronic Components on the Printed Board</title>
      <link>https://trid.trb.org/View/2603819</link>
      <description><![CDATA[With the increasing demands for higher functionality in electronic parts, it is essential to develop design techniques that ensure stable solder joints during the manufacturing process when implementing advanced semiconductors and components on printed circuit boards at high densities. Since fillet lift-off of the solder joints was observed on experimental boards, this paper introduces consideration about lift off phenomena and the robust design method of design parameters by utilizing simulations and AI.]]></description>
      <pubDate>Thu, 20 Nov 2025 17:07:20 GMT</pubDate>
      <guid>https://trid.trb.org/View/2603819</guid>
    </item>
    <item>
      <title>A Scalable Approach for Transient Thermal Modeling of Automotive
          Power Electronics</title>
      <link>https://trid.trb.org/View/2624079</link>
      <description><![CDATA[Efficient thermal management is critical for the reliability and performance of                     power electronics systems in automotive applications. This work presents a                     computationally efficient modeling approach for transient thermal simulation of                     power electronic systems, with a focus on inverter modules using multiple                     MOSFETs mounted on a printed circuit board assembly (PCBA). A case study of an                     inverter module comprising six MOSFETs arranged as high-side and low-side pairs                     for a three phases system mounted on a PCBA, attached to a heat sink is                     considered. Computational fluid dynamic (CFD) simulations in Ansys®                         Icepak™ are performed considering different heat transfer                     mechanisms, including natural convection, forced convection at constant                     velocity, and forced convection with varying flow velocity. A transient thermal                     model is developed using the lumped parameter linear superposition (LPLSP)                     method, a hybrid approach that combines lumped parameter modeling with the                     principle of linear superposition to capture transient thermal behavior                     efficiently. Temperatures of the components from the simulations are compared                     with temperatures from the LPLSP model and temperatures from a linear time                     invariant (LTI)–based reduced-order model (ROM) developed for this system. It is                     observed that the LPLSP model is able to model a wide range of use cases very                     accurately with error of less than 5%. This method enables rapid thermal                     performance evaluation of power electronics systems that have very fast                     transients in component-level power dissipation and variations in ambient                     conditions, making it particularly well-suited for early stage design iterations                     and long-duration mission profile simulations. The approach offers a practical                     path to reducing development cycles for automotive power electronics design.]]></description>
      <pubDate>Thu, 13 Nov 2025 16:29:50 GMT</pubDate>
      <guid>https://trid.trb.org/View/2624079</guid>
    </item>
    <item>
      <title>Robust Design of Automotive Inverter Components using Tests and Simulations</title>
      <link>https://trid.trb.org/View/2539634</link>
      <description><![CDATA[Vibration qualification tests are indispensable for vehicle manufacturers and suppliers. Carmakers’ specifications are therefore conceived to challenge the mechanical endurance of car components in the face of numerous in-service detrimental phenomena: In automotive industries, components are commonly qualified by means of a test without failure, the goal being to determine whether it will or not "pass" customer requirements. Validation of newly designed components is obtained via bench test and structural simulation. Simulation has gained traction in recent years because it represents the first step of the design validation process. In particular, FEA simulations are powerful to predict the dynamic behavior of physical testing on prototypes, enable engineers to optimize the design and predict the durability. This paper illustrates how FEA simulations were applied to product validation in the pre-serial phase to optimize manufacturing process. In particular, we will focus on the PCB of an electrical driven compressor (EDC), undergoing final vibration validation tests up to failure to reinforce the product. Two failure modes were identified and fixed thanks to simulation's iterations. The first failure mode regarded one of the PCB components: the simulation results lead to a more reliable manufacturing process, particularly to the additional damping element (glue) and its optimal position on the critical PCB elements. The second failure mode concerned the optimization of the screwing torque that holds the PCB rigidly with the housing. Understanding various screws angles and torque values sensibly ameliorated the mechanical endurance of the PCB during the shaker test. The novelty of this approach lies in using simulations to control the PCB's dynamic response (e.g., optimizing applied glues to avoid stress concentration) and optimizing the PCB assembly components. In addition to simulation, controlling screw angle in testing is essential for achieving a uniform assembly process, thereby reducing the risk of variability-induced stress concentrations.]]></description>
      <pubDate>Tue, 15 Apr 2025 13:56:51 GMT</pubDate>
      <guid>https://trid.trb.org/View/2539634</guid>
    </item>
    <item>
      <title>Prediction of Water Film Thickness Due to Condensation over Instrument Cluster Based on Eulerian Wall Film Approach of Computational Fluid Dynamics</title>
      <link>https://trid.trb.org/View/2446810</link>
      <description><![CDATA[This paper investigates the condensation within a two-wheeler instrument cluster in different weather conditions. Instrument cluster have high heating components within its assembly particularly over Printed Circuit Board (PCB) which leads to formation of condensation. Air breathers are important component that can be utilized to reduce the condensation in the cluster. Location and orientation of air breather and air vents plays the vital role in the air flow through the instrument cluster. In this study, number of breathers, their location and orientation are optimized to reduce the condensation or film thickness on the crystal (transparent body) of cluster. Transient Computational Fluid Dynamics (CFD) based Eulerian Wall Film approach is utilized to investigate the physics administering the condensation phenomenon in the instrument cluster. Experimental tests are conducted to investigate condensation phenomenon actually occurring in the model. Similar results are found by employing the numerical modelling and hence the numerical approach is validated. The validated numerical approach is employed to mitigate the present design by optimizing the breather locations and air vents. The optimized model predicts enhanced properties by reducing the condensation phenomena in the cluster. The algorithm employed to reduce the condensation in clusters can be further utilized for other complex designs.]]></description>
      <pubDate>Mon, 28 Oct 2024 16:33:39 GMT</pubDate>
      <guid>https://trid.trb.org/View/2446810</guid>
    </item>
    <item>
      <title>Thermal Management of E-Components in EV Using Passive Cooling Technique (an Overmould Concept)</title>
      <link>https://trid.trb.org/View/2437275</link>
      <description><![CDATA[Thermal management in electric vehicles plays a significant role, in keeping all the electronic components under the safe operating region for lower power dissipation, higher efficiency and this increases the component’s life. Based on the increase in range of e-vehicles, the power dissipation requirement had increased from OEMs. In addition, the compact size, weight, and limited cooling technique have increased the thermal management requirements in printed circuit boards (PCB). In a passive cooling technique, high thermally conductive metal with plastic overmould concept in PCB cover or housing will have a huge advantage in transferring the heat from e-components to keep within operating temperature conditions [1, 6]. The advantage of alumina or mica metal insert is that it has higher thermal conductivity and electrical resistivity, which helps to dissipate the heat at a higher level when it is locally in contact with hot spot regions of the PCB. This concept also helps to reduce the mass of the products by having plastic overmould [3] housing instead of a die-cast housing. This passive cooling technique will boost thermal management in PCB e-components, irrespective of all vehicle applications [1, 4].]]></description>
      <pubDate>Tue, 01 Oct 2024 14:46:45 GMT</pubDate>
      <guid>https://trid.trb.org/View/2437275</guid>
    </item>
    <item>
      <title>Printed Circuit Board Coils of Multitrack Litz Structure for 3.3-kW Inductive Power Transfer System</title>
      <link>https://trid.trb.org/View/2403887</link>
      <description><![CDATA[This article presents the optimization procedure of an inductive power transmission (IPT) system, which utilizes large size spiral printed circuit board (PCB) coils for high-power transfer. PCBs for coil assembly provide advantages in the manufacturing process through the use of cost-effective flexible fabrication techniques. Furthermore, this kind of construction offers a low-profile device, which is of great interest for applications with space constraints. PCB-based IPT system coils can achieve high energy efficiency by applying Litz-structure braiding techniques, as investigated in this work, where the objective was to obtain an optimized balance between the conduction losses and the proximity losses associated with the number and dimensions of the traces. Considering the geometrical dimensions and manufacturing constraints, the authors will proceed to obtain the characteristics of the coil to achieve optimal performance. The estimation of coil losses was in part based on finite-element simulations, and the results were conveniently processed with the appropriate mathematical methods. Numerical simulation and experimental results were conducted for validation on a prototype suitable to transfer up to 3.3 kW for a transmitter (TX)–receiver (RX) distance of 10 cm. In the experimental arrangement, a maximum efficiency in the coils of 93% has been measured, and the overall efficiency of 88% has been reached for the entire IPT system.]]></description>
      <pubDate>Fri, 20 Sep 2024 16:24:56 GMT</pubDate>
      <guid>https://trid.trb.org/View/2403887</guid>
    </item>
    <item>
      <title>Fatigue Life Assessment of Rail Transit Electronics Based on Physics of Failure</title>
      <link>https://trid.trb.org/View/1975880</link>
      <description><![CDATA[The failure prediction and life assessment method based on physics of failure (PoF) approach has been more widely used. This paper mainly describes the fatigue life assessment process design of board-level PCBA based on PoF approach. At first, the complete board-level PCBA fatigue life evaluation process is given, and the application of PoF model in various stages of the evaluation process is stated. Then a detailed description of their applicable conditions, as well as input and output parameters when they are applicated are given, thus providing a reference for the fatigue life evaluation and reliability design and evaluation of PCBA.]]></description>
      <pubDate>Fri, 23 Aug 2024 16:53:42 GMT</pubDate>
      <guid>https://trid.trb.org/View/1975880</guid>
    </item>
    <item>
      <title>Thermal Analysis of Components and Traces on Printed Circuit Boards</title>
      <link>https://trid.trb.org/View/2334929</link>
      <description><![CDATA[High currents flowing through various traces of a printed circuit boards (PCB) causes thermal run away and PCB warpage due to the occurrence of high heat density. The present study discusses on steady state thermal analysis performed in a PCB kept inside an enclosure. Thermal analysis allows PCB designer to quickly move and confirm the component’s placement by examining the temperature plots predicted on the PCB surface. A PCB particularly designed for automated manual transmission (AMT) application employed in Ashok Leyland electric vehicle (EV) trucks is used for this present study. The performed simulations are preliminary level and carried out with commercially available software Altair Simlab ElectroFlo 2022.3. Simlab is a PCB level EDA (Electronic Design Automation) software suite used for design and analysis, and thus helps in minimizing the development cycles. The power dissipation for each and every component and the component analysis power level plays a significant role in deciding the temperature at various components in the PCB. The temperature at various locations of the PCB and enclosure is predicted and compared with some benchmark values presently available and measured at the vehicle level. A good agreement is observed between both the predicted and measured values. Here, the objective is to detect these thermal issues at the initial design level itself, so as to improve reliability of the controller.]]></description>
      <pubDate>Fri, 26 Apr 2024 08:54:31 GMT</pubDate>
      <guid>https://trid.trb.org/View/2334929</guid>
    </item>
    <item>
      <title>Design and development of a Formula Student electric racecar's control system</title>
      <link>https://trid.trb.org/View/2343990</link>
      <description><![CDATA[The Formula Student electric racecar 'Thunderblade 4.0' control system developed by Team Kratos Racing Electric at Pimpri Chinchwad Education Trust's Pimpri Chinchwad College of Engineering has undergone significant improvements. Implementing a centralised power distribution unit has resulted in notable wiring harness optimisation. The proposed work has also focused on enhancing the functionality of the circuits. The team incorporated wire fault detection circuits, advanced logic circuits, and test points to improve the vehicle's safety and reliability. In addition to these improvements, it has also incorporated software tools like the Saturn Printed Circuit Board Toolkit and Altium Designer Rule Wizard. These tools have enabled the team to develop better printed circuit board designs. Overall, the control system has successfully analysed the failures of the previous season and proposed solutions to ensure the development of a reliable and competitive vehicle. The control system components are described, and the initiative has achieved its objectives of weight optimisation, power delivery efficiency, and improved functionalities of the circuits.]]></description>
      <pubDate>Wed, 27 Mar 2024 11:51:55 GMT</pubDate>
      <guid>https://trid.trb.org/View/2343990</guid>
    </item>
    <item>
      <title>Study of Critical Vias Design Parameters for Power Electronics Thermal Management</title>
      <link>https://trid.trb.org/View/2335026</link>
      <description><![CDATA[With the advent of wide band gap semiconductor devices like SiC based MOSFETs/Diodes, there is a growing demand for utilizing electrical power instead of the conventional fuel-based power generation in both automotive and aerospace industry. In automotive/aerospace industry the focus on electrification has resulted in a need for sub-systems like inverters, power distribution units, motor controllers, DC-DC converters that actively utilize SiC based power electronics devices. To address the growing power density requirements for electronics in next generation product families, more efficient & reliable thermal management solution plays a critical role. The effective thermal management of the power electronics is also critical aspect to ensure overall system reliability. The conventional thermal management system (TMS) optimization targets heat sink/cold plate design parameters like fin spacing, thickness, height etc. or sizing of the required cooling pump/fan. This paper focuses on reducing the thermal resistance offered by printed circuit boards (PCBs) with the use of Via-in-pad technology embedded inside the PCBs for power electronics thermal management. In this work Computational Fluid Dynamics (CFD) modeling has been extensively used to study different Vias arrangements and arrive at an optimum design. The critical parameters associated with the design of thermal Vias like spacing, diameter, plating thickness and conductive fill have been studied and the optimized PCB design has been prototyped and tested to validate the analysis findings. The studies presented in this paper will help in optimizing the cooling architecture for power electronics assemblies used in automotive and aerospace industry that will enhance system reliability.]]></description>
      <pubDate>Fri, 23 Feb 2024 16:21:29 GMT</pubDate>
      <guid>https://trid.trb.org/View/2335026</guid>
    </item>
    <item>
      <title>Diagnostics and Troubleshooting of Ships Digital Electronics Systems</title>
      <link>https://trid.trb.org/View/2338837</link>
      <description><![CDATA[On modern transport vessels, digital and computer technology is ubiquitous. Crew members often have to maintain and repair digital electronic and computer equipment themselves. This paper presents a methodology for troubleshooting and setting up digital devices. It covers ten rules for debugging a variety of circuit board types, digital or analog circuitry, power supplies and mixed hybrid integral circuits. The rules provide a practical and systematic tool for solving common problems associated with information control computer electronic systems.]]></description>
      <pubDate>Wed, 21 Feb 2024 16:47:39 GMT</pubDate>
      <guid>https://trid.trb.org/View/2338837</guid>
    </item>
    <item>
      <title>Assessing Enterprise Level, Augmented Reality Solutions for Electronics Manufacturing</title>
      <link>https://trid.trb.org/View/2155536</link>
      <description><![CDATA[With the growth of Industry 4.0 in recent years, Augmented Reality (AR) technologies are changing the way operators work by increasing their efficiency and operational performance. A common use of AR is providing operators helpful work instructions for assembly by presenting relevant digital information in the context of the physical environment. These AR experiences can be viewed via several devices such as mobile, wearable, and stationary devices, each being useful for different applications. While in the experience, instructions are provided by means of 3D animation, text, images, and interactive buttons, all of which are directly overlaid onto the physical product or equipment being worked on. This work presents a closed-loop, enterprise connected, AR system for post end Printed Circuit Board (PCB) assembly work instructions. The system is designed to work with a stationary device, allows for varying types of PCB”s, provides overlaid instruction, and logs important information to an enterprise system, such as overall cycle time, step cycle time, number of errors, type of error, and who performed the assembly. A comparison was made for single cell manual assembly PCB work instructions using both an Industry 4.0 driven system and a more traditional manufacturing system which used packets, tracers, Manufacturing Execution System (MES), and PDF instructions. Discovered benefits of an enterprise connected AR system included increased throughput and utilization, improved communication between operators and support, reduced overtime costs, reduced defects, reduced non-value-added secondary inspections, nearly 50% increase in ergonomics, reduced labor due to rework, and improved corrective actions due to granularity between steps compared to total operation. This AR driven solution transformed the single cell manual assembly to be more informed, make better decisions, and help operator productivity.]]></description>
      <pubDate>Thu, 27 Apr 2023 17:02:15 GMT</pubDate>
      <guid>https://trid.trb.org/View/2155536</guid>
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