Determination of the Performance of Chip Seal, Applied With HSKSC (Accelerated Chip Seal Simulation Device) on Unbound Base

Chip seals applied on unbound granular base are an asphalt pavement type that is widely used in countries such as Turkey, Australia, New Zealand, and South Africa. Although several methods and techniques regarding design of chip seals and measurement of performance of chip seal on-site and under laboratory conditions have been developed in recent years, there is no evidence that a device, system or method, allowing cost-effectively pre-measurement of performance of chip seals, existed in laboratory setting. In this study, Accelerated Chip Seal Simulation Device (HSKSC), which was developed and designed in Suleyman Demirel University (Turkey) and allows measurement of chip seal, applied on unbound granular base, under laboratory conditions and desired climate conditions as described, and results of two different performance tests performed with this device were discussed. Two different chip seals (single-layer and double-layer) were designed with this device and double-layer, single-layer chip seal samples were subjected to performance test in the device under a mild climate and hot climate respectively. During the tests, macro surface texture and numbers of friction-skid resistance were measured. As the number of cycles increases considerable decrease appeared particularly on macro texture and a limited decrease in micro texture. It was concluded that the performance tests to be carried out by means of prototype Accelerated Chip Seal Simulation Device (HSKSC) would be useful for design of chip seal applied on unbound granular bases.

Language

  • English

Media Info

  • Media Type: DVD
  • Features: Figures; Photos; References; Tables;
  • Pagination: 12p
  • Monograph Title: TRB 90th Annual Meeting Compendium of Papers DVD

Subject/Index Terms

Filing Info

  • Accession Number: 01333302
  • Record Type: Publication
  • Report/Paper Numbers: 11-1225
  • Files: TRIS, TRB
  • Created Date: Mar 21 2011 2:13PM